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| ESDALC6V1Px ASD (Application Specific Devices) Low capacitance TRANSILTM arrays for ESD protection Main applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: Computers Printers Communication systems Cellular phone handsets and acessories Wireline and wireless telephone sets Set top boxes SOT663 SOT665 SOT666IP Order code Part number ESDALC6V1P3 ESDALC6V1P5 ESDALC6V1P6 Marking A2 A1 D Features 2 to 4 unidirectional Transil functions Breakdown voltage VBR = 6.1 V min. Low leakage current < 100 nA Low capacitance (7.5 pF @ 3 V) Very small PCB area < 2.6 mm2 ESDALC6V1P3 functional diagram Description The ESDALC6V1Px are monolithic suppressors designed to protect components connected to data and transmission lines against ESD. These devices clamp the voltage just above the logic level supply for positive transients and to a diode drop below ground for negative transients. ESDALC6V1P5 functional diagram Benefits High ESD protection level High integration Complies with the following standards: IEC61000-4-2 level 4: 15 kV(air discharge) 8 kV(contact discharge) MIL STD 883E-Method 3015-7: class3 25 kV HBM (Human Body Model) TM: TRANSIL is a trademark of STMicroelectronics ESDALC6V1P6 functional diagram October 2006 Rev 3 1/9 www.st.com 9 Characteristics ESDALC6V1Px 1 Characteristics Table 1. Symbol VPP(1) PPP Tj Tstg TL Top Peak pulse voltage Absolute ratings (Tamb = 25 C) Parameter IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge Value 8 15 30 150 -55 to +150 260 -40 to +150 Unit kV W C C C C Peak pulse power (8/20 s)(1) Tj initial = Tamb Junction temperature Storage temperature range Maximum lead temperature for soldering during 10 s Operating temperature range 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Symbol VRM VBR VCL IRM IPP T VF C Rd Electrical characteristics (Tamb = 25 C) Parameter Stand-off voltage Breakdown voltage Clamping voltage Leakage current Peak pulse current Voltage temperature coefficient Forward voltage drop Capacitance Dynamic resistance VBR@ IR IRM @ VRM max. mA 1 A 0.1 V 3 Rd typ. 1.5 T typ. 10-4/C 4.5 C typ.@ 3V pF 7.5 Slope: 1/Rd IPP VF VCL VBR VRM IRM V IF I Part Number min. V max. V 7.2 ESDALC6V1P3 ESDALC6V1P5 ESDALC6V1P6 6.1 2/9 ESDALC6V1Px Characteristics Figure 1. Peak power dissipation versus initial junction temperature Figure 2. Peak pulse power versus exponential pulse duration (Tj initial = 25 C) PPP[T j initial] / PPP [T j initial=25C] 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 175 Tj(C) 10 100 1000 PPP(W) Tj initial = 25C tp(s) 1 10 100 Figure 3. Clamping voltage versus peak pulse current (typical values, rectangular waveform) Figure 4. Forward voltage drop versus peak forward current (typical values) IPP(A) 100.0 tp = 2.5s Tj initial = 25C IFM(A) 1.E+00 Tj = 125C Tj = 25C 10.0 1.E-01 1.0 1.E-02 VCL(V) 0.1 0 10 20 30 40 50 60 70 1.E-03 0.0 0.2 0.4 0.6 0.8 VFM(V) 1.0 1.2 1.4 1.6 1.8 2.0 Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Relative variation of leakage current versus junction temperature (typical values) C(pF) 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 F=1MHz VOSC=30mVRMS Tj=25C IR [T j] / IR [T j=25C] 1.E+04 VR =3 V 1.E+03 1.E+02 1.E+01 VR(V) 1.E+00 25 50 75 T j(C) 100 125 150 3/9 Ordering information scheme ESDALC6V1Px Figure 7. ESD response to IEC 61000-4-2 (air Figure 8. discharge 15 kV positive surge) 0.00 -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 -100.00 Analog crosstalk measurement 10 V per div. dB F (Hz) 1.0M 10.0M 100.0M 1.0G 0.1 s per division 100.0k Figure 9. Digital crosstalk test measurement 5 V per div. VG1 21VG1 0.1 s per div. 2 Ordering information scheme ESDA ESD Array Low Capacitance Breakdown Voltage (min) 6V1 = 6.1 Volt Package P3 = SOT-663 (SC89-3L) P5 = SOT-665 P6 = SOT-666IP (internal pad) LC 6V1 Px 4/9 ESDALC6V1Px Package information 3 Package information Table 3. SOT-663 dimensions Dimensions Ref. Millimeters Min. D b A Inches Min. Typ. Max. Typ. 0.70 1.60 0.85 1.60 0.39 0.47 0.13 0.27 0.50 1.00 Max. 0.80 1.80 0.95 1.70 0.50 0.18 0.37 1.10 7 A D E HE L L2 c 0.60 1.40 0.75 1.50 0.44 0.08 0.22 0.90 4 0.024 0.028 0.031 0.055 0.063 0.071 0.030 0.033 0.037 0.059 0.063 0.067 0.015 0.017 0.018 0.020 0.003 0.005 0.007 0.009 0.011 0.015 0.020 0.035 0.040 0.043 4 7 HE E alpha L e 2xe L2 c b e 2xe Figure 10. SOT-663 footprint (dimensions in mm) 5/9 Package information Table 4. SOT-665 dimensions ESDALC6V1Px Dimensions Ref. Millimeters Min. bp D E Inches Min. 0.020 0.007 0.003 0.060 0.043 0.040 0.020 Max. 0.024 0.011 0.007 0.067 0.051 Max. 0.60 0.27 0.18 1.70 1.30 A BP C Lp He C 0.50 0.17 0.08 1.50 1.10 1.00 0.50 1.50 0.10 A D E e e1 He 1.70 0.30 0.059 0.004 0.067 0.012 e1 e Lp Figure 11. SOT-665 footprint (dimensions in mm) 6/9 ESDALC6V1Px Table 5. SOT-666IP dimensions Package information Dimensions b1 L1 L4 Ref. Millimeters Min. Typ. Max. Min. Inches Typ. Max. 0.024 0.007 0.013 A L3 b D E1 0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.50 0.19 0.10 0.10 0.60 0.27 0.60 0.018 0.18 0.003 0.34 0.007 A3 b b1 D A L2 E A3 0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043 0.020 0.007 0.30 0.004 0.004 0.024 0.012 0.067 0.067 0.051 E E1 e L1 L2 e L3 L4 Figure 12. SOT-666IP footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information ESDALC6V1Px 4 Ordering information Part number ESDALC6V1P3 ESDALC6V1P5 ESDALC6V1P6 Marking A2 A1 D Package SOT663 SOT665 SOT666IP Weight 2.9 mg 2.9 mg 2.9 mg Base qty 3000 3000 3000 Delivery mode Tape and reel Tape and reel Tape and reel 5 Revision history Date 16-Aug-2006 23-Aug-2006 11-Oct-2006 Revision 1 2 3 Description of changes ESDALC6V1P3, ESDALC6V1P5, and ESDALC6V1P6 merged and reformatted to current standards. Table 1 on page 2: Temperature range upgraded to Tj max = 150 C Added values for VPP in Table 1. 8/9 ESDALC6V1Px Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9 |
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